An electrically conductive adhesive is dispensed into laser-cut holes for the electrical connection of flexible solar films.
Perovskite-based and organic photovoltaic (OPV) cells represent a promising pathway to renewable energy generation due to their potential for lightweight, flexible, and potentially cost-effective solar power generation. Panacol complements new OPV technologies with Elecolit® 3648, a newly developed conductive adhesive. Elecolit® 3648 addresses one of the critical challenges in the commercialization and long-term reliability of organic solar cells: creating long-lasting, flexible electrical connections that create and maintain reliable electrical circuits.
Electronic components are typically connected by soldering. But solder materials are rigid and inflexible, and soldering temperatures are often too high for potentially heat-sensitive photoactive materials. Conventional conductive adhesives cure at lower temperatures but can still be brittle and inflexible.
This is why Elecolit® 3648 is a significant introduction. It is a very flexible, conductive adhesive. As it adheres well to plastics, including PI, PC, PVC, ABS, and FR4, Elecolit® 3648 is the perfect choice for an efficient attachment of wire leads and components to create flexible connections.
Elecolit® 3648 can be cured at relatively low temperatures of 80°C within a few minutes. At higher temperatures, Elecolit® 3648 can be hardened within seconds as a “snap cure” adhesive. As a one-component system, Elecolit® 3648 simplifies manufacturing processes by eliminating the need for mixing and therefore ensures a consistent application. It is easy to process and can be dispensed by conventional dispensing equipment, by jetting or screen printing.
Elecolit® 3648 can efficiently secure flexible resistors and create flexible electrical connections in solar cells to lead the generated electricity from the conductive tracks to the end device. This adhesive is also effective in touch sensors or wearable devices where flexibility is a desired property.
These features make Elecolit® 3648 the perfect solution to replace solder joints in applications subjected to vibration, oscillation or rapid temperature changes. This can includes all configurations of flexible electronics, and specifically OPV. As the adhesive maintains its integrity after repeated bending and stretching, Elecolit® 3648 can help to facilitate the development of new devices that withstand challenging operating conditions without losing performance.
Visit us from 23rd to 24th October 2024 at TechBlick in Berlin, Estrel Congress Center, Booth C03, to get more information about our latest adhesive developments.
About Panacol
Panacol-Elosol GmbH was founded in 1978 as a German subsidiary of the Swiss Panacol AG in Frankfurt. In 2008, Panacol was acquired by Munich-based Dr. Hönle AG, a leading global supplier of industrial UV equipment technology. As a member of the Hönle Group, Panacol is a knowledgeable and reliable provider of adhesives, coatings, and UV/LED curing equipment for OEM and contract manufacturers around the world.
